|XYQ-2150 Foam Peeling Machine is mainly used for round foam continuous first for long wafer cutting work, control cutting thickness through change gear (the machine also can choose ball screw and servo control system, change the original gear control cutting thickness, using the latest digital control technology, the operation is more flexible, more accurate cutting precision.|
|Max cutting size||Φ2000X2150mm|
|Cutting thickness range||2~25mm|
|Thickness control||Gear control|
Remark: The above date of only for reference, all the parameter is subjected to sell the production
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