XYQ-2150 Foam Peeling Machine

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XYQ-2150 Foam Peeling Machine is mainly used for round foam continuous first for long wafer cutting work, control cutting thickness through change gear (the machine also can choose ball screw and servo control system, change the original gear control cutting thickness, using the latest digital control technology, the operation is more flexible, more accurate cutting precision.

Technical Specification:

 ModelXYQ-2150
Max cutting sizeΦ2000X2150mm
Cutting thickness range2~25mm
Total power6.59kw
Peeling speed25m~30m/min
Thickness controlGear control
Machine weight1800kg
Machine size(LxWxH)4560x1650x1950mm

Remark: The above date of only for reference, all the parameter is subjected to sell the production

XYQ-2150 Foam Peeling Machine

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